| NO. |
ITEM |
PARAMETER |
| 1 |
Surface processing type |
HAL, HAL lead free, OSP, Immersion gold, Immersion tin, Immersion silver, Flux, Carbon film, Chemical nickel, Chemical tin, ENTEK (OSP ), Ni/Au plating, Flash gold, Flash nickel |
| 2 |
Layers |
1-14 layers |
| 3 |
Min. line width |
0.076mm |
| 4 |
Min. line space |
0.076mm |
| 5 |
Min. line to pad/ pad to pad space |
0.076mm |
| 6 |
Min. drill diameter |
0.2mm |
| 7 |
Min. via pad |
0.45mm |
| 8 |
Max. drill board thickness% |
1 ：6.4 |
| 9 |
Max. board size |
500 × 650mm |
| 10 |
Molding board thickness |
0.4 -4.0mm |
| 11 |
Min. solder mask dam |
0.08mm |
| 12 |
Min. solder mask clearance |
0.05mm |
| 13 |
Min. solder mask thickness |
0.4mil |
| 14 |
Solder mask type |
LPI Solder mask、Hot solidified solder mask、 UV solder mask |
| 15 |
Min. character line width |
0.1mm |
| 16 |
Min.character height |
0.7mm |
| 17 |
Silk-screen character color |
White、Yellow、Black、Green |
| 18 |
Data file format |
GERBER file、 PCB file、 DWG file、 R-274-X |
| 19 |
Electricity performance testing |
Impedance、Open & short test、Special tool test、Flying probe test |
| 20 |
Base materail to PCB processing |
FR4 、 FR1 、 CEM-1 、 CEM-3 、 XPC 、 22F、High TG、Halogen Free |
| 21 |
Other testing request |
Immersion tin test、Pull test、Impedance test |
| 22 |
Special craft ability |
HAL+gold fingers、Blind hole board、V-shape Hole board |
Company
